Memory packages and methods of forming same
Number of patents in Portfolio can not be more than 2000
United States of America
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Mar 22, 2022
Grant Date -
Jul 22, 2021
app pub date -
Jan 17, 2020
filing date -
Jan 17, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A package includes a memory stack attached to a logic device, the memory stack including first memory structures, a first redistribution layer over and electrically connected to the first memory structures, second memory structures on the first redistribution layer, a second redistribution layer over and electrically connected to the second memory structures, and first metal pillars on the first redistribution layer and adjacent the second memory structures, the first metal pillars electrically connecting the first redistribution layer and the second redistribution layer, wherein each first memory structure of the first memory structures includes a memory die comprising first contact pads and a peripheral circuitry die comprising second contact pads, wherein the first contact pads of the memory die are bonded to the second contact pads of the peripheral circuitry die.
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