Head interconnect circuit with alignment finger
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United States of America Patent
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-
Jun 4, 2002
Grant Date -
N/A
app pub date -
Sep 13, 1999
filing date -
Sep 14, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circuit to a printed circuit supported on an head actuator including aligning an alignment finger on the lead tip with a printed surface of a drive circuit for soldering leads on the lead tip to solder pads or connectors on the drive circuit.
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