Copper-phosphorus-tin brazing wire and preparation method thereof

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United States of America Patent

PATENT NO 11931828
APP PUB NO 20230405731A1
SERIAL NO

18169192

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Abstract

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The present disclosure provides a copper-phosphorus-tin brazing wire and a preparation method thereof, relates to the technical field of brazing materials. The copper-phosphorus-tin brazing wire is of a three-layer structure, the inner layer is Cu, the middle layer is Cu-14P alloy, and the outer layer is Sn, wherein the mass percentage of Sn is over 7%. The present disclosure solves the technical problems in the prior art that the copper-phosphorus-silver brazing filler metal is prone to produce defects such as pores and inclusions when brazing copper alloys, which leads to the decline of the mechanical properties of the joint, and simultaneously provides the preparation method of the copper-phosphorus-tin brazing wire, such that the technical problem that it is difficult to obtain copper-phosphorus-tin brazing wire with a wire diameter below 0.5 mm under the condition of high Sn content is solved.

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Patent Owner(s)

  • ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO., LTD

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Yafang Henan, CN 7 2
Ding, Tianran Henan, CN 2 0
Huang, Junlan Henan, CN 7 0
Jiu, Yongtao Henan, CN 4 0
Lu, Quanbin Henan, CN 5 0
Zhang, Guanxing Henan, CN 3 0
Zhong, Sujuan Henan, CN 7 0

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