Process kit components for titanium sputtering chamber
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United States of America Patent
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Jul 29, 2014
Grant Date -
Jul 26, 2007
app pub date -
Nov 12, 2006
filing date -
Nov 25, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A process kit for a sputtering chamber comprises a deposition ring, cover ring, and a shield assembly, for placement about a substrate support in a sputtering chamber. The deposition ring comprising an annular band with an inner lip extending transversely, a raised ridge substantially parallel to the substrate support, an inner open channel, and a ledge radially outward of the raised ridge. A cover ring at least partially covers the deposition ring, the cover ring comprising an annular plate comprising a footing which rests on a surface about the substrate support, and downwardly extending first and second cylindrical walls.
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