Copper foil for printed wiring board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 8, 2003
Grant Date -
N/A
app pub date -
May 24, 2000
filing date -
May 25, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.
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