Wafer dicing/die bonding sheet
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United States of America Patent
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Dec 12, 2006
Issued Date -
N/A
app pub date -
Nov 17, 2003
filing date -
Nov 18, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.
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