Multilayer wiring substrate
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United States of America Patent
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-
Apr 2, 2019
Grant Date -
Nov 16, 2017
app pub date -
May 30, 2017
filing date -
Dec 19, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a multilayer wiring substrate capable of achieving excellent conduction reliability. The multilayer wiring substrate is formed by laminating an anisotropic conductive member including an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each conductive path has a protrusion protruding from the surface of the insulating base, and a wiring substrate having a substrate and one or more electrodes to be formed on the substrate, and conductive paths which come into contact with the electrode among the plurality of conductive paths are deformed so that adjacent conductive paths come into contact with each other.
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