System and method for cooling electronic assemblies
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United States of America Patent
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Mar 14, 2006
Grant Date -
Oct 13, 2005
app pub date -
Mar 31, 2004
filing date -
Mar 31, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A cooling assembly is disclosed comprising one or more heat pipes heat pipes connected to a base member, a plurality of thermal plates connected to the one or more heat pipes at predefined intervals, wherein the one or more heat pipes intersects the plurality of thermal plates, and an opening fashioned in each one of the plurality of thermal plates.
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