Adhesive suitable for a pellicle for EUV lithography and a pellicle using the same adhesive

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United States of America Patent

PATENT NO 10126645
APP PUB NO 20170123308A1
SERIAL NO

15337747

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Abstract

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A pellicle is proposed in which an adhesive layer is formed of an adhesive which undergoes a hardness change at a rate from −50% through +50% of its initial hardness, measured after curing, when it is let to sit in atmosphere of a temperature of 300 degrees C. for 7 days on end; the rate of hardness change being defined by a following equation:

description='In-line Formulae' end='lead'Rate of hardness change (%)={(hardness after the sitting)−(initial hardness before the sitting)}÷initial hardness before the sitting)×100.description='In-line Formulae' end='tail'

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Patent Owner(s)

  • SHIN-ETSU CHEMICAL CO. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Horikoshi, Jun Gunma-Ken, JP 28 293

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