Semiconductor packaging method and semiconductor package device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11948911
APP PUB NO 20210257334A1
SERIAL NO

17308473

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Abstract

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The present disclosure provides a semiconductor packaging method and a semiconductor package device. The semiconductor packaging method includes providing a chip, where the chip includes a chip substrate having a front surface and a back surface, where the front surface includes a photosensitive region; soldering pads disposed at the front surface of the chip substrate surrounding the photosensitive region; a metal part formed on a side of each soldering pad facing away from the chip substrate; and a transparent protective layer formed on the front surface of the chip substrate, where a first end of the metal part is exposed by protruding over a surface of the transparent protective layer. The method further includes electrically connecting the first end of the metal part to a circuit board using a conductive connection part, such that the chip is electrically connected to the circuit board.

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Patent Owner(s)

  • TONGFU MICROELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yu, Guoqing Nantong, CN 23 152

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