Method for producing circuit substrate having bump contact point and jet stream type plating apparatus used therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 25, 2000
Grant Date -
N/A
app pub date -
Sep 26, 1997
filing date -
Sep 26, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for producing a circuit substrate having a bump contact point, comprising the steps of (a) disposing a positive electrode in a plating solution stored in a storage tank, (b) exposing a conductive circuit formed on an insulating substrate, above the surface of the plating solution, (c) disposing a jet stream opening below the surface of the plating solution, and (d) spouting out the plating solution from the jet stream opening toward the negative electrode for electroplating using said conductive circuit as a negative electrode, to form the bump contact point on the surface of the negative electrode, and a jet stream type plating apparatus used therefor. According to the present invention, mixing of air bubbles in the plating solution can be inhibited, which in turn enables suppression of oxidative decomposition of the brightener components. As a consequence, the bump contact point can have a mushroom shape, and variation in the height of the bump contact points can be minimized. In addition, slip of the vertex of the bump contact point and loss of bump contact points can be avoided.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully