Integrated circuit package structure and integrated circuit package unit
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United States of America Patent
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Nov 21, 2023
Grant Date -
N/A
app pub date -
Sep 8, 2021
filing date -
Sep 10, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
An IC package structure including an array of package units formed into a panel-shaped package units array. Each package unit has a continuous and closed metal wall surrounding the periphery of the package unit and at least one IC chip/IC die disposed in the package unit, and wherein each IC chip/IC die has a top surface and a back surface opposite to the top surface. A panel-shaped metal layer corresponding to the panel-shaped package units array can be formed on entire back side of the IC package structure and bonded to the metal wall of each package unit, wherein the back side of the IC package structure refers to the side to which the back surface of each IC chip/IC die is facing.
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