Semiconductor processing component
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United States of America Patent
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Mar 23, 2004
Issued Date -
N/A
app pub date -
Jul 22, 2002
filing date -
Jun 28, 1999
priority date (Note) -
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Abstract
A semiconductor processing component includes a quartz body characterized by silicon oxide filled micro cracks. The component is utilized as a processing component in a semiconductor furnace system. The quartz body is prepared by cleaning the component to remove a build up silicon layer and to expose micro cracks in the surface of the component and to etch the micro cracks into trenches. A silicon layer is applied onto the processing component body and at least a portion of the silicon is oxidized to silica to fill the trenches in the surface of the component body.
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