Contact bump construction for the production of a connector construction for substrate connecting surfaces
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United States of America Patent
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Mar 7, 2006
Grant Date -
Mar 18, 2004
app pub date -
Dec 19, 2001
filing date -
Dec 20, 2000
priority date (Note) -
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Abstract
Contact bump construction (27) and method for the production of a contact bump construction for the formation of elevated contact sites on connecting surfaces (22) of a substrate (21), particularly chip connecting surfaces, with a spacer metallization (28) for the attainment of a defined height of the contact bump construction, wherein the spacer metallization (28) consists at least partly of annealed copper.
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