Purging apparatus and purging method
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United States of America Patent
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Feb 2, 2010
Grant Date -
Dec 7, 2006
app pub date -
Apr 28, 2004
filing date -
Apr 28, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
It is an object of the present invention to easily and securely perform the removal operation of contaminant or the like from a wafer housed in a FOUP. To achieve the object, a purging apparatus of the present invention removes contaminant or the like from a wafer by moving a gas supply nozzle along a direction in which wafers are superimposed at the front of an opening while a lid of the FOUP is separated from a body and spraying clean gas on each wafer from the gas supply nozzle.
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