On-chip test circuit for assessing chip integrity
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United States of America Patent
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Aug 14, 2007
Grant Date -
Feb 1, 2007
app pub date -
Jul 29, 2005
filing date -
Jul 29, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor chip includes an active inner circuit; a die seal ring surrounding the active inner circuit; a first circuit structure fabricated at a first corner of the semiconductor chip outside the die seal ring and electrically connected to the die seal, wherein the first circuit structure has a first solder pad; and a second circuit structure fabricated at a second corner of the semiconductor chip outside the die seal ring and electrically connected to the die seal, wherein the second circuit structure has a second solder pad.
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