Semiconductor device and method of making the same, circuit board and electronic equipment
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Jul 15, 2003
Grant Date -
Mar 14, 2002
app pub date -
Aug 30, 2001
filing date -
Aug 31, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing a semiconductor device includes a step of providing a semiconductor chip having electrodes to face a tape having a plurality of first holes, a support member surrounded by the first holes, and leads extending across the first holes to the support member; a step of bonding the electrodes to the leads; a step of cutting the leads in the first holes; and a step of bending the leads to go around a lateral portion of the support member.
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