Grounding structure of high frequency circuit board

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United States of America Patent

PATENT NO 11252814
APP PUB NO 20200344874A1
SERIAL NO

16645956

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A grounding structure of the high-frequency circuit board includes a dielectric substrate, a back surface ground electrode, an upper ground electrode, and a microstripline upper electrode. The dielectric substrate has a first surface and a second surface, and is provided with a first through-hole. A first opening of the first through-hole at the first surface is smaller than a second opening of the first through-hole at the second surface. A first grounding conductor layer is provided in the first through-hole. The back surface ground electrode is provided at the second surface and is connected with the first grounding conductor layer. The upper ground electrode is provided at the first surface and is connected with the first ground conductor layer. The microstripline upper electrode is provided at the first surface.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA; TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asahi, Yasuaki Kawasaki, JP 6 3
Kojima, Haruo Kawasaki, JP 21 95

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