Thin die release for semiconductor device assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11791212
APP PUB NO 20210183702A1
SERIAL NO

16713309

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Abstract

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Methods for releasing thinned semiconductor dies from a mount tape and associated apparatuses are disclosed. In one embodiment, a sacrificial layer may be disposed at a back side of thinned substrate including semiconductor dies. The sacrificial layer includes materials soluble in contact with a fluid (and/or vapor). A sheet of perforated mount tape may be attached to the sacrificial layer and an ejection component may be provided under a target semiconductor die to be released. The ejection component is configured to create a locally confined puddle of the fluid under the target semiconductor die such that the sacrificial layer is removed to release the target semiconductor die from the mount tape. Further, a support component may be provided to pick up the target semiconductor die after the target semiconductor die is released from the mount tape.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INC8000 SOUTH FEDERAL WAY POST OFFICE BOX 6 BOISE ID 83707-0006

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bayless, Andrew M Boise, US 43 39
Wirz, Brandon P Boise, US 53 86

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