Molded direct contact interconnect structure without capture pads and method for the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11973051
APP PUB NO 20230387060A1
SERIAL NO

18195090

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Abstract

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An electronic assembly may include a component comprising conductive studs disposed over an active layer of the component. A first encapsulant layer may be disposed around four side surfaces of the component, over the active layer of the component, and contacting at least a portion of the sides of the conductive studs. A substantially planar surface may be disposed over the active layer of the component, wherein the substantially planar surface comprises ends of the conductive studs and the first encapsulant layer. The first encapsulant layer comprises a roughness less than 500 nanometers. First conductive elements may be disposed over the encapsulant and coupled with the conductive studs. A second layer of encapsulant may be disposed over the first conductive elements.

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Patent Owner(s)

  • DECA TECHNOLOGIES USA, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bishop, Craig Scottsdale, US 54 651
Davis, Robin Vancouver, US 11 0
Hoffman, Paul R San Diego, US 39 1331
Olson, Timothy L Phoenix, US 49 1103
Sandstrom, Clifford Richfield, US 14 1

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