Semiconductor package having enhanced ball grid array protective dummy members
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 11, 2001
Grant Date -
N/A
app pub date -
Jan 28, 2000
filing date -
Jan 29, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor package having: a chip-sized wiring board that has a predetermined wiring pattern; a semiconductor chip that is mounted on the wiring board and is electrically connected to the wiring pattern; sealing resin that seals at least the connection part of the wiring board and the semiconductor chip; an array of solder balls for external circuit connection that are connected through an opening in the sealing resin to a land of the wiring pattern; and a protective member that is disposed along at least two sides of the surface where the array of solder balls are provided.
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