Die contact formations

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11135839
APP PUB NO 20200164645A1
SERIAL NO

16629120

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Hua Corvallis, US 404 2928
Cumbie, Michael W Corvallis, US 269 904
Fuller, Anthony Corvallis, US 5 90
Li, Zhen Yi Corvallis, US 1 1

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Apr 5, 2025
7.5 Year Payment $3600.00 $1800.00 $900.00 Apr 5, 2029
11.5 Year Payment $7400.00 $3700.00 $1850.00 Apr 5, 2033
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00