Heat-resistant electronic systems and circuit boards with heat resistant reinforcement dispersed in liquid metal
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United States of America Patent
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May 7, 2002
Issued Date -
N/A
app pub date -
Jun 21, 1999
filing date -
Feb 25, 1997
priority date (Note) -
Expired
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Abstract
A heat resistant system have electronic circuit components fusion bonded onto a circuit board substrate with a heat-resistant composite material. The composite material consists essentially of a solid heat-resistant reinforcement dispersed in a liquid metal matrix of the composite material. The heat-resistant reinforcement differs in density by substantially uniformly and stably distribute in the liquid composite matrix, with substantially no tendency to either sink down or float up therein. This stably uniform distribution enures improved uniformly, reproducibility and heat resistance of the circuit board.
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