Substrate integrated posts and heat spreader customization for enhanced package thermomechanics

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11328979
APP PUB NO 20200194335A1
SERIAL NO

16639956

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A device package and a method of forming a device package are described. The device package includes a plurality of posts disposed on a substrate. Each post has a top surface and a bottom surface that is opposite from the top surface. The device package also has one or more dies disposed on the substrate. The dies are adjacent to the plurality of posts on the substrate. The device package further includes a lid disposed above the plurality of posts and the one or more dies on the substrate. The lid has a top surface and a bottom surface that is opposite from the top surface. Lastly, an adhesive layer attaches the top surfaces of the plurality of posts and the bottom surface of the lid. The device package may also include one or more thermal interface materials (TIMs) disposed on the dies.

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Patent Owner(s)

  • INTEL CORP.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beatty, John J Chandler, US 17 67
Chan, Arguedas Sergio Chandler, US 9 13
Eid, Feras Chandler, US 266 945
Padmanabhan, Ramalekshmi Thanu Dinesh Chandler, US 4 6
Swan, Johanna M Scottsdale, US 269 1966

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