Printed circuit board
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United States of America Patent
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Jun 3, 2003
Grant Date -
N/A
app pub date -
Sep 7, 1999
filing date -
Sep 7, 1998
priority date (Note) -
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Abstract
A printed circuit board includes a number of ball-shaped terminals provided on one main surface of the board. Each of the ball-shaped terminals includes a metallic ball brazed on a pad provided on the main surface of the board. A thin gold layer is deposited by plating on the surface of the metallic ball.
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