Surface acoustic wave device with reduced size and thickness
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United States of America Patent
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Aug 20, 2013
Grant Date -
Aug 16, 2012
app pub date -
Apr 20, 2012
filing date -
Mar 3, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A package structure realizing a size and/or thickness reduction and suitable for packaging a surface acoustic wave element is provided. The package structure for solving the above challenge includes a base having a thick floor on which to place a surface acoustic wave element and a thin floor on which to place an electronic component, the surface acoustic wave element and the electronic component being mounted close to each other on the plane coordinate system. In addition, in the package structure described above, the difference in height between the thin floor and the thick floor is the same as, or larger than, the thickness of the electronic component mounted on the thin floor.
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