Semiconductor package and production method thereof, and semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 13, 2024
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N/A
app pub date -
Nov 26, 2018
filing date -
Nov 26, 2018
priority date (Note) -
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Abstract
An object is to provide technology that enables cost reduction or downsizing of semiconductor packages. The wiring element includes a second substrate, a plurality of first relay pads arranged on a surface of the second substrate opposite to the conductor substrate and connected to each of the control pads of the plurality of semiconductor elements by wires, a plurality of second relay pads arranged on the surface of the second substrate opposite to the conductor substrate, the number thereof being equal to or lower than the number of the plurality of first relay pads, and a plurality of wiring portions arranged on the surfaceof the second substrate opposite to the conductor substrate and selectively connecting the plurality of first relay pads and the plurality of second relay pads.
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