Semiconductor package with passive electrical component and method for the production thereof

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11217504
APP PUB NO 20200035581A1
SERIAL NO

16519975

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Abstract

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A double-sided coolable semiconductor package includes an upper electrically conductive element having an outwardly exposed metal surface, a lower carrier substrate having an upper electrically conductive layer, a lower electrically conductive layer with an outwardly exposed surface and an electrical insulating layer arranged between the upper and lower electrically conductive layers, a first electrically conductive spacer arranged between the upper electrically conductive element and the upper electrically conductive layer, a power semiconductor chip arranged between the upper electrically conductive element and the upper electrically conductive layer, a second electrically conductive spacer arranged between the upper electrically conductive element and the power semiconductor chip, and a passive electrical component electrically connected to the upper electrically conductive layer of the lower carrier substrate.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haase, Ordwin Taufkirchen, DE 9 57
Hoegerl, Juergen Regensburg, DE 80 476
Kist, Tobias Effeltrich, DE 6 6

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