Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
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United States of America Patent
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Jul 14, 2009
Grant Date -
Feb 21, 2008
app pub date -
Oct 12, 2007
filing date -
Aug 21, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the semiconductor substrate, and the electrodes being formed on the interconnects; a resin layer formed on the semiconductor substrate; redistribution interconnects electrically connected with the electrodes; a plurality of external terminals which are formed on the redistribution interconnects and supported by the resin layer; and a plurality of dummy terminals supported by the resin layer without being electrically connected with the electrodes.
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