Method of producing a semiconductor sensor component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 9, 2007
Grant Date -
Jul 29, 2004
app pub date -
Feb 21, 2002
filing date -
Apr 7, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for manufacturing a semiconductor component, such as, for example, a multilayer semiconductor component including a micromechanical component, such as, for example, a heat transfer sensor having a semiconductor substrate of silicon, and a sensor region. For inexpensive manufacture of a thermal insulation between the semiconductor substrate and the sensor region a porous layer is provided in the semiconductor component.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully