Semiconductor image sensor device having back side illuminated image sensors with embedded color filters

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United States of America Patent

PATENT NO 11735619
APP PUB NO 20220302187A1
SERIAL NO

17833217

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Abstract

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Disclosed is a method of fabricating a semiconductor image sensor device. The method includes providing a substrate having a pixel region, a periphery region, and a bonding pad region. The substrate further has a first side and a second side opposite the first side. The pixel region contains radiation-sensing regions. The method further includes forming a bonding pad in the bonding pad region; and forming light-blocking structures over the second side of the substrate, at least in the pixel region, after the bonding pad has been formed.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chiu-Jung Tainan, TW 14 89
Chen, Hsin-Chi Tainan, TW 164 610
Cheng, Yun-Wei Taipei, TW 185 511
Chien, Volume Tainan, TW 83 472
Chou, Chun-Hao Tainan, TW 150 348
Lee, Kuo-Cheng Tainan, TW 254 616

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