Electronic package with stud bump electrical connections

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11552035
APP PUB NO 20210366862A1
SERIAL NO

17392598

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.

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Patent Owner(s)

  • INTEL CORP.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ganesan, Sanka Chandler, US 79 476
Karhade, Omkar Chandler, US 82 88
Li, Zhaozhi Chandler, US 9 10
Liff, Shawna M Gilbert, US 195 1157
Lu, Kuan H Chandler, US 7 4
Mallik, Debendra Chandler, US 177 2179
Perry, Gregory Santa Clara, US 2 2

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