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Abstract

The compression set of elastomeric silicone compositions, addition cured injection moldable compositions, is reduced by the incorporation of nitrogen compounds wherein the nitrogen possesses at least one organic substituent and the nitrogen is tetravalent wherein the nitrogen is cationic. The adhesion of such compositions to thermoset or thermoplastic polymer substrates is improved by the addition of bis(trimethoxysilylpropyl)fumarate and a disilanol that may or may not contain alkenyl groups. The lubricity of such compositions is improved by the addition of compounds selected from the group consisting of diorganosiloxanes such as polydimethylsiloxanes, phenyl containing siloxanes such as copolymers of diphenylsiloxane with diorganosiloxanes and copolymers of methylphenylsiloxane with diorganosiloxanes, fluorosilicones such as silicones containing trifluoropropyl substituted siloxanes, polydimethylsiloxanes, aliphatic and aromatic hydrocarbons that are liquid between 0.degree. C. and 100.degree. C. without adversely affecting the adhesion of the composition.

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First Claim