Test device and method for signalling metal failure of semiconductor wafer
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United States of America Patent
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May 7, 1996
Grant Date -
N/A
app pub date -
Oct 12, 1994
filing date -
Oct 12, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Method and test structures for accurately flagging metal failure on a semiconductor wafer include a monitor structure and a control structure, each of which has a plurality of metal segments. At least one metal segment of the monitor structure has a length prone to failure, while the length of the metal segments in the control structure are such that the control structure is resistant to metal failure. The monitor and control structures are predesigned to have equal resistance when there is no metal failure and a measurable resistance difference upon metal failure in that segment of the monitor structure prone to failure. Upon detecting metal failure in the test device, the wafer is flagged as potentially having metal failure in active circuitry interconnect wiring.
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