Plastic packaged semiconductor device having bonding wires which are prevented from coming into contact with each other in plastic sealing step
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 3, 1991
Grant Date -
N/A
app pub date -
Sep 10, 1990
filing date -
Sep 12, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Bonding pads for deriving out electrodes of semiconductor elements formed on a pellet to the exterior are formed on the pellet. The pellet is mounted on a bed. Inner lead portions of a lead frame are arranged on the surrounding portion of the bed to extend radially away from the bed. A distance between those of the inner lead portions which are disposed in position corresponding to the corner portion of the bed is set larger than a distance between those of the inner lead portions which are disposed in the other position. The bonding pads are electrically connected to the inner lead portions by means of bonding wires. The pellet, bed, inner lead portions and bonding wires are sealed into a plastic package.
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