Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
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United States of America Patent
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May 1, 2007
Issued Date -
N/A
app pub date -
Apr 20, 2004
filing date -
Aug 24, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Machines with solution dispensers and methods of using such machines for chemical-mechanical planarization and/or electrochemical-mechanical planarization/deposition of microelectronic workpieces. One embodiment of such a machine includes a table having a support surface, a processing pad on the support surface, and a carrier assembly having a head configured to hold a microelectronic workpiece. The carrier assembly can further include a drive assembly that manipulates the head. The machine can also include a solution dispenser separate from the head. The solution dispenser can include a support extending over the pad and a fluid discharge unit or distributor carried by the support. The fluid discharge unit is configured to discharge a planarizing solution onto a plurality of separate locations across the pad.
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