Integrated circuit chip to substrate interconnection
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United States of America Patent
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-
Dec 19, 2000
Issued Date -
N/A
app pub date -
May 13, 1998
filing date -
Dec 6, 1996
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An interconnection between bonding pads on an integrated circuit chip and corresponding bonding contacts on a substrate are formed. To form the interconnection, a metallization is formed on each of the substrate bonding contacts. Metal ball bond bumps are formed on selective ones of the bonding pads and then coined. The substrate and integrated circuit chip are heated. The coined ball bond bumps are then placed into contact with the corresponding metallizations, pressure and ultrasonic energy are applied, and a metal-to-metal bond is formed between each coined ball bond bump and the corresponding metallization.
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