Method for wafer dicing and composition useful thereof

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United States of America Patent

PATENT NO 8883701
SERIAL NO

13171252

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Abstract

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A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.

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Patent Owner(s)

  • VERSUM MATERIALS US, LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Banerjee, Gautam Latham, US 22 208
Parris, Gene Everad Coopersburg, US 16 182
Ramamurthi, Rajkumar Cave Creek, US 3 13
Rao, Madhukar Bhaskara Fogelsville, US 34 503
Rennie, David Barry Bethlehem, US 7 140
Tamboli, Dnyanesh Chandrakant Breinigsville, US 23 161

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