Very ultra thin conductor layers for printed wiring boards
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United States of America Patent
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-
Mar 9, 2004
Grant Date -
Mar 20, 2003
app pub date -
Oct 29, 2002
filing date -
May 14, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a metal-clad laminate product having a carrier film, a aqueous soluble release or parting layer deposited onto the carrier film and which can be mechanically separated from the carrier film, and an ultra thin metal layer deposited onto the parting layer. Also disclosed is a method for making the metal-clad laminate product.
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