Heat curable molding composition
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United States of America Patent
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-
Oct 6, 1981
Issued Date -
N/A
app pub date -
Dec 6, 1979
filing date -
Feb 18, 1977
priority date (Note) -
Expired
status (Latency Note)
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Abstract
What is disclosed is an improved heat curable molding composition which has increased flowability in the mold. The improvement is gained by the use of a fine, spherical noncrystalline filler along with the normal molding compound fillers.
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Cited Art Landscape
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