Semiconductor failure analysis apparatus which acquires a failure observed image, failure analysis method, and failure analysis program
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United States of America Patent
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Jan 4, 2011
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N/A
app pub date -
Oct 26, 2006
filing date -
Jun 14, 2006
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Abstract
extracts as a candidate interconnection for a failure, an interconnection passing an analysis region, out of a plurality of interconnections, using interconnection information to describe a configuration of interconnections in the semiconductor device by a pattern data group of interconnection patterns in respective layers, and, for extracting the candidate interconnection, it performs an equipotential trace of the interconnection patterns using the pattern data group, thereby extracting the candidate interconnection. This substantializes a semiconductor failure analysis apparatus, failure analysis method, and failure analysis program capable of securely and efficiently performing the analysis of the failure of the semiconductor device using the failure observed image.
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