Wire bond wires for interference shielding

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11462483
APP PUB NO 20200118939A1
SERIAL NO

16715524

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC3025 ORCHARD PARKWAY SAN JOSE CA 95134

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Awujoola, Abiola Pleasanton, US 18 162
Prabhu, Ashok S San Jose, US 39 476
Subido, Willmar San Jose, US 15 280
Sun, Zhuowen Campbell, US 49 326
Zohni, Wael Campbell, US 152 2939

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