Lidless semiconductor cooling
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United States of America Patent
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Jul 20, 2010
Grant Date -
Aug 21, 2008
app pub date -
Feb 16, 2007
filing date -
Feb 16, 2007
priority date (Note) -
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Abstract
A system for cooling a semiconductor includes a heat sink in thermal contact with the semiconductor, a thermal interface material (TIM) layer disposed between the heat sink and the semiconductor, and a picture frame support disposed between a substrate of the semiconductor and the heat sink, wherein the picture frame support encloses at least a portion of the semiconductor in a plane between the substrate and the heat sink, and wherein the picture frame support has a height that is greater than a height of the semiconductor.
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