Liquid crystal display device assembled by flip chip technology comprising a folded multi-layered flexible driving circuit substrate
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United States of America Patent
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-
Nov 17, 1998
Grant Date -
N/A
app pub date -
Nov 4, 1996
filing date -
Nov 16, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
To make it possible to prevent disconnection of the wiring on a driving multilayer flexible circuit board when folding the board, to reliably fold the circuit board, to improve the assemblability and the reliability or a backlight member, and to improve the noise resistance in a clip-chip-type liquid crystal display device using the circuit board, one end of a flexible substrate FPC2 is connected to an end of one transparent glass substrate SUB1 constituting a liquid crystal display element, the intermediate portion of the flexible substrate FPC2 is folded nearby the outside of an end side of the substrate SUB1, the other end of the substrate FPC2 is arranged at the lower side of an end of the substrate SUB1, and an end of a film BFI of the flexible substrate FPC2 is formed into a waved pattern along the folding line.
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