Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniform
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United States of America Patent
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Oct 21, 2008
Grant Date -
May 31, 2007
app pub date -
Nov 27, 2006
filing date -
Nov 29, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention grinds the rear surface side of a device area to form a recessed portion and an annular reinforcement part on the outer periphery of the recessed portion, removes the annular reinforcement part by grinding or cutting the rear surface of the annular reinforcement part so as to give the wafer a uniform thickness, locates the position of streets in the front surface of the wafer by infrared imaging from the rear surface side of the wafer, and after dividing the wafer into individual devices affixes dicing tape to the rear surface of the wafer divided into devices, supports the rear surface of the wafer on a dicing frame and peels a protective member off the front surface of the wafer, thereby enabling the wafer to be supported using ordinary dicing tape while posing no obstacle to device pick-up after division of the wafer.
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