Thermal print head and method of fabricating thereof
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United States of America Patent
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Mar 12, 2024
Grant Date -
Oct 20, 2022
app pub date -
Apr 18, 2022
filing date -
Apr 20, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure provides a thermal print head and a method of fabricating the thermal print head. The thermal print head includes a substrate made of a semiconductor material and having a main surface and a convex portion, a resistor layer including a plurality of heat generating portions on the convex portion, and a wiring layer conducted to the plurality of heat generating portions and formed to contact the resistor layer. The convex portion has a top surface, a first inclined surface and a second inclined surface. At least one of two ends of the convex portion in the main scanning direction forms a third inclined surface connected to the main surface and the first inclined surface, and a fourth inclined surface connected to the main surface and the second inclined surface.
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