Semiconductor device and electronic control unit using the same
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United States of America Patent
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Mar 16, 2010
Grant Date -
Jun 28, 2007
app pub date -
Dec 8, 2006
filing date -
Dec 9, 2005
priority date (Note) -
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Abstract
A semiconductor device has a substrate with an electronic circuit, a semiconductor element provided at a first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer electrically connected to the semiconductor element. A plurality of conductive bumps provided opposite the first surface of the substrate. A thermal hardenable resin seals at least the semiconductor element, and a metal plate is electrically connected to the metal core layer.
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