Apparatus for non-conductively interconnecting integrated circuits
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United States of America Patent
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Jan 11, 2011
Grant Date -
Dec 25, 2008
app pub date -
Jan 17, 2008
filing date -
Jun 24, 1993
priority date (Note) -
Expired
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Abstract
An apparatus for constructing, repairing and operating modular electronic systems utilizes peripheral half-capacitors (i.e., conductive plates on the outside of the modules) to communicate non-conductively between abutting modules. Such systems provide lower cost, improved testability/reparability and greater density than conventional modular packaging techniques, such as printed circuit boards and multi-chip modules. The non-conductive interconnection technique of the invention can be applied to all levels in the packaging hierarchy, from bare semiconductor dies to complete functional sub-units. Numerous exemplary systems and applications are described.
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