Semiconductor manufacturing device and method of processing wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 17, 2001
Grant Date -
N/A
app pub date -
Jun 2, 1998
filing date -
Dec 3, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A hot plate unit includes a cover. The cover includes an inner wall and an outlet. There is provided immediately under the outlet a plate having a ventilation hole. The distance between the plate and a main surface is identical to the distance between the main surface and the internal wall face. The hot plate unit has an displacement control valve for restricting displacement at a level in the range from at least 0.1 L/min to at most 1 L/min.
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