Inspection method and semiconductor device
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United States of America Patent
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May 5, 2009
Grant Date -
Nov 2, 2006
app pub date -
Apr 25, 2006
filing date -
Apr 28, 2005
priority date (Note) -
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Abstract
It is an object to provide an inspection method to enable simple and easy inspection of the electrical connecting state between a connecting terminal of a semiconductor integrated circuit over a substrate such as a glass substrate or a plastic substrate and a crimp connecting terminal of a flexible printed circuit. A crimp inspection terminal is provided to a flexible printed circuit so as to inspect all connecting terminals of the semiconductor integrated circuit over the substrate. A crimp connecting terminal and a crimp inspection terminal are connected with one connecting terminal of the semiconductor integrated circuit by thermocompression. By such a configuration, the inspection of the electrical connecting state between the connecting terminal and the crimp inspection terminal, in the other words, the inspection of conducting state can be performed by using only an external connecting terminal of the flexible printed circuit through the crimp inspection terminal.
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